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The latest NewsJaws reporting on Advanced chip packaging: developments, background and what happens next, with every source linked.
2 NewsJaws reports, latest
GlobalFoundries plans to expand its Malta, New York, factory to supply components linking AI processors and memory. Volume production is expected to begin ramping in the first half of 2028.
GlobalFoundries plans to supply TSMC with silicon interposers that connect AI processors and memory. The planned New York capacity comes as advanced packaging constrains chip production.